#wafer_backgrinding
Wafer backgrinding
Used to reduce the thickness of a microchip, for die stacking or for thin devices
Wafer backgrinding is a semiconductor device fabrication step during which wafer thickness is reduced to allow stacking and high-density packaging of integrated circuits (IC).
Mon 1st
Provided by Wikipedia
This keyword could refer to multiple things. Here are some suggestions:
0 searches
This keyword has never been searched before
This keyword has never been searched for with any other keyword.