Keywords

#fan-out_wafer-level_packaging

Fan-out wafer-level packaging

Fan-out wafer-level packaging is an integrated circuit packaging technology, and an enhancement of standard wafer-level packaging (WLP) solutions. Fan-out packaging is seen as a low cost advanced packaging alternative to packages that use silicon interposers, such as those seen in 2.5D and 3D packages.

Fri 29th

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Wafer-level packaging Fan-out wafer-level packaging Advanced packaging (semiconductors) Fan-out ASE Group List of integrated circuit packaging types Redistribution layer GDDR6 SDRAM Glossary of microelectronics manufacturing terms Embedded wafer level ball grid array
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