Keywords

#redistribution_layer

Redistribution layer

Layer used to relocate a microchip's contacts

A redistribution layer (RDL) is an extra metal layer on an integrated circuit that makes its I/O pads available in other locations of the chip, for better access to the pads where necessary.

Thu 19th

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Redistribution layer Wafer-level packaging Fan-out wafer-level packaging Glossary of microelectronics manufacturing terms Semiconductor device fabrication List of integrated circuit packaging types 45 nm process Atmosphere of Earth Double layer (surface science) Veeco
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